?SET ACCμRA M 鍵合機(jī)

       法國SET的鍵合壓力控制在不同的范圍內(nèi)采用了不同的高精度壓力傳感器，確保了在不同的壓力范圍內(nèi)，都能夠得到zui佳的壓力控制精度。

Applications

? Laser diode, laser bar ? VCSEL, photo diode

? LED

? Prisms, lenses, mirrors ? Micro assembly

? Flip-chip bonding, die bonding

? Chip-to-chip, chip-to-substrate bonding

Specifications

? Accuracy* ±1 μm

?Post-bond accuracy: +/- 5 μm

?Range of force

Low force arm: 20 g to 1 kg

High force arm: 100 g to 20 kg

?Temperature up to 400°C Independent heating for chip and substrate

?High resolution vertical movement 74 mm, resolution 0.01 μm Driven by linear motor